Wii U Caratteristiche Hardware della Nuova Console

FUSION DS:
CPU: ARMv8-A Cortex-A53 GPU: Custom Adreno 420-based AMD GPU
COM MEMORY: 3 GB LPDDR3 (2 GB Games, 1 GB OS)
- 2 130 mm DVGA (960 x 640) Capacitive Touchscreen
- Slide Out Design with Custom Swivel Tilt Hinge
- Upper Screen made of Gorilla Glass, Comes with Magnetic Cover
- Low End Vibration for Gameplay and App Alerts
- 2 Motorized Circle Pads for Haptic Feedback
- Thumbprint Security Scanner with Pulse Sensing Feedback
- 2 1mp Stereoptic Cameras
- Multi-Array Microphone
- A, B, X, Y, D-Pad, L, R, 1, 2 Buttons
- 3 Axis Tuning Fork Gyroscope, 3 Axis Accelerometer, Magnetometer
- NFC Reader
- 3G Chip with GPS Location
- Bluetooth v4.0 BLE Command Node used to Interface with Bluetooth Devices such as Cell Phones, Tablets
- 16 Gigabytes of Internal Flash Storage (Possible Future Unit With 32 Gigbytes)
- Nintendo 3DS Cart Slot
- SDHC “Holographic Enhanced” Card Slot up to 128 Gigabyte Limit
- Mini USB I/O
- 3300 mAh Li-Ion battery

FUSION TERMINAL:
GPGPU: Custom Radeon HD RX 200 GPU CODENAME LADY (2816 shaders @ 960 MHz, 4.60 TFLOP/s, Fillrates: 60.6 Gpixel/s, 170 Gtexel/s)
CPU: IBM 64-Bit Custom POWER 8-Based IBM 8-Core Processor CODENAME JUMPMAN (2.2 GHz, Shared 6 MB L4 cache)
Co-CPU: IBM PowerPC 750-based 1.24 GHz Tri-Core Co-Processor CODENAME HAMMER
MEMORY: 4 Gigabytes of Unified DDR4 SDRAM CODENAME KONG, 2 GB DDR3 RAM @ 1600 MHz (12.8 GB/s) On Die CODENAMED BARREL
- 802.11 b/g/n Wireless
- Bluetooth v4.0 BLE
- 2 USB 3.0
- 1 Coaxial Cable Input
- 1 CableCARD Slot
- 4 Custom Stream-Interface Nodes up to 4 Wii U GamePads or 4 DSc
- Versions with Disk Drive play Wii U Optical Disk (4 Layers Maximum), FUSION Holographic Versatile Disc (HVD) and Nintendo 3DS Card Slot.
- 1 HDMI 2.0 1080p/4K Port
- Dolby TrueHD 5.1 or 7.1 Surround Sound
- Inductive Charging Surface for up to 4 FUSION DS or IC-Wii Remote Plus Controllers
- Two versions: Disk Slot Version with 60 Gigs of Internal Flash Storage and Diskless Version with 300 Gigs of Internal Flash Storage.